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Optica Online Industry Meeting: PIC Packaging for Volume Production


25 February 2025 10:00 - 11:30

Eastern Time (US & Canada) (UTC -05:00)

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Join our online industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. We will explore strategies for high throughput and yield, essential in today's tech landscape.

The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. We will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.
 

Moderators

Jose Pozo
Jose Pozo

Optica - Chief Technology Officer

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Jon Pugh
Jon Pugh

Optica - Director, Photonic Integrated Circuits and Quantum Technologies

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Speakers

Peter O'Brien
Peter O'Brien

Tyndall National Institute - Director Photonics Packaging Pilot Line

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Nick Psaila
Nick Psaila

Intel - Principal Engineer and Technology Development Manager

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Jeroen Duis
Jeroen Duis

PHIX Photonics Assembly - Chief Technology Officer

Jeroen Duis received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX Photonics Assembly where he was responsible for the commercial activities and the strategic direction for the hybrid packaging.  He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology. In September 2024 he moved to the position of Chief Technology Officer.

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Douwe Geuzebroek
Douwe Geuzebroek

Brilliance RGB - Chief Technology Officer

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Sander Dorrestein
Sander Dorrestein

CITC - Program Manager Integrated Photonics Packaging

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Valentin Strässle
Valentin Strässle

vario-optics - Senior Engineer Photonic Processes

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Leili Shiramin
Leili Shiramin

IMEC - Program Manager Silicon Photonics

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Yasutaka Mizuno
Yasutaka Mizuno

Sumitomo Electric Industries - Assistant Manager

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Laura Horan
Laura Horan

Vanguard Automation/Mycronic - Product Management Lead

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Kees Propstra
Kees Propstra

Quantifi Photonics - VP Global Sales & Marketing, GM US

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Rolando Ferrini
Rolando Ferrini

FEMTOprint - Chief Regional Officer & Head of FEMTOprint Neuchâtel

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Travis Scott
Travis Scott

Finetech - Business Development Manager

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Aldo Gutierrez
Aldo Gutierrez

EXFO - Business Development Manager

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Marco Koelink
Marco Koelink

RJR Technologies, Inc - Business Development Manager Europe

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Philipp-Immanuel Dietrich
Philipp-Immanuel Dietrich

Keystone Photonics - Co-founder and Chief Executive Officer

Philipp Dietrich is a co-founder and CEO of Keystone Photonics, a company based in Karlsruhe, Germany that offers products for optical wafer-level testing using additive microfabrication. He is also a co-founder of Vanguard Automation, a company providing industry-grade machines and processes for photonic integration based on additive microfabrication. Philipp Dietrich received his PhD from the Karlsruhe Institute of Technology for his work on the fabrication and application of functional microstructures.

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Andon Bano
Andon Bano

FiconTEC - International Sales Engineer

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Doron Tal
Doron Tal

Newphotonics - SVP & GM Optical Connectivity

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