Optica Online Industry Meeting: PIC Packaging for Volume Production
25 February 2025 10:00 - 11:30
Eastern Time (US & Canada) (UTC -05:00)Sponsors
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Join our online industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. We will explore strategies for high throughput and yield, essential in today's tech landscape.
The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. We will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.
Moderators
Speakers
Jeroen Duis
PHIX Photonics Assembly - Chief Technology Officer
Jeroen Duis received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX Photonics Assembly where he was responsible for the commercial activities and the strategic direction for the hybrid packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology. In September 2024 he moved to the position of Chief Technology Officer.
