Skip To Content

Speakers

OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March 2021
-


Alexis Black Björlin

Senior Vice President and General Manager of the Optical Systems Division, Broadcom

Anu Agarwal

Massachusetts Institute of Technology

Daniel Kilper

Research Professor, Optical Sciences, CIAN, University of Arizona

Darius Bunandar

Founder and Chief Scientist, Lightmatter

David Chen

AVP of Transceiver Technology & Strategic Marketing, Applied Optoelectronics, Inc. (AOI)

Gordon Keeler

Program Manager in the Microsystems Technology Office (MTO), Defense Advanced Research Projects Agency,DARPA

Ken Giewont

Fellow - Technology Development, GLOBALFOUNDRIES

Larry Dennison

Director of Network Research, NVIDIA

Madeleine Glick

Senior Research Scientist, Columbia University

Mark Filer

Microsoft

Sun

Optical Architect, Tencent

Nick Harris

Lightmatter

Peter O'Brien

Director, European Photonics Packaging Pilot Line (PIXAPP) & Head of Photonics Packaging Group, Tyndall Institute

Philippe Absil

Vice President R&D, Head of the 3D and Silicon Photonics Technologies Department, IMEC

Richard Grzybowski

General Manager of Silicon Photonics, Lightwave Business Unit, MACOM

Rob Stone

Facebook

Robert Blum

Director, Strategic Marketing & Business Development , Intel Corporation

Sandeep Razdan

Senior Principal Engineer in the Optical Systems Division (OSD), Broadcom

Sven Otte

CEO, Sicoya

Sylvie Menezo

SCINTIL Photonics

Ted Schmidt

Distinguished Engineer, Silicon Photonics, Juniper

Thomas Liljeberg

General Manager, Photonic Integration; Silicon Photonics Products Division, Intel

Tom Hausken

Senior Industry Advisor, The Optical Society

Twan Korthorst

Director, Synopsys Photonic Solutions, Phoenix/Synopsys

Vikas Gupta

GlobalFoundries

Yi Qian

MRSI Systems & Mycronic

Image for keeping the session alive