Session 1—Perspectives from operators

How do data center operators view the future path of integration of photonics with switch electronics?  What are their preferred technology choices and timelines?  Are their plans changing due to changing user behavior with regard to applications or industry profitability?  Likewise, have they had to change expectations due to supply chain issues and other uncertainties in the technology? 

Speakers:

• Hong Liu, Google

• Moray McLaren, Microsoft

• Katharine Schmidtke, Meta

• John Shalf, Lawrence Berkeley National Laboratory

• Craig Thompson, NVIDIA

Session 2—Needs of system integrators 

What do system integrators need from suppliers in the transition to co-packaged optics and electronics from face-pluggable transceivers?  What solutions already exist and what needs improvement?  What pieces are missing and how can suppliers bridge the gaps?  

Speakers:

• Jeff Maki, Juniper

• Andy Bechtolsheim, Arista

• Anthony Torza, Cisco

• David Welch, Infinera

• Radha Nagarajan, Marvell

Session 3—Board-level solutions

Vendors of board-level products will report on the progress toward co-packaged solutions, and what is needed from the manufacturing ecosystem, including materials, subcomponents, and manufacturing equipment.

Speakers:

• Jean-Philippe Fricker, Cerebras Systems

• Mitchell Nahmias, Luminous Computing

• Rebecca Schaevitz, Broadcom

• Tom Mader, OpenLight

• Thomas Liljeberg, Intel

Session 4—Making it happen at the component level

In this closing session, optics suppliers and manufacturers will offer their perspectives and open a discussion about the path toward co-packaging, including common challenges and solutions.   

Speakers:

• Jim Theodoras, HGGenuine
   
• Mark Wade, Ayar Labs
   
• Aleksandra Boskovic, Corning
   
• Tom Marrapode, Molex
   
• Richard Grzybowski, MACOM