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Digital Holography and Three-Dimensional Imaging (DH)


Optica Imaging Congress

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Submission Deadline: 15 Apr 2025 12:00
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Digital Holography and Three-Dimensional Imaging (DH)

The Digital Holography and Three-Dimensional Imaging Topical Meeting provides a forum for science, technology, applications of digital holographic, three-dimensional imaging and display methods.

This highly interdisciplinary meeting is related to science, technology and applications of digital holography and three-dimensional imaging.

Topic areas include interferometry, quantitative phase imaging, transport of intensity methods, 3D imaging and display systems including VR/AR, computer generated holograms, metasurface holograms, digital holography with various light sources including coherent to incoherent and X-ray to terahertz waves, polarization and dynamic holography, compressive holography, specific image and signal processing and digital holographic methods for microscopy, tomography, optical processing, lithography, metrology, scattering media inspection, remote sensing, non-linear optical systems, bio- and nano-photonics.

 

 

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Chairs

Lisa Miccio

Institute of Intelligent Systems ISASI, Italy,
General Chair

George Nehmetallah

Catholic University of America, United States,
General Chair

Tatiana Latychevskaia

Universität Zürich,
Program Chair

Yuan Luo

National Taiwan University, Taiwan,
Program Chair

Naveen Nishchal

Indian Institute of Technology Patna, India,
Program Chair

Committee Members

  • Lisa Miccio, Institute of Intelligent Systems ISASI, Italy, General Chair
  • George Nehmetallah, Catholic University of America, United States, General Chair
  • Tatiana Latychevskaia, Universität Zürich, Program Chair
  • Yuan Luo, National Taiwan University, Taiwan, Program Chair
  • Naveen Nishchal, Indian Institute of Technology Patna, India, Program Chair
  • Tatiana Alieva, Universidad Complutense de Madrid, Spain
  • Percival Almoro, University of the Philippines-Diliman, Philippines
  • Pierre-Alexandre Blanche, Amazon, United States
  • Liangcai Cao, Tsinghua University, China
  • Ni Chen, University of Hong Kong, Hong Kong
  • Chau-Jern Cheng, National Taiwan Normal University, Taiwan
  • Juergen Czarske, TUD | Dresden University of Technology, Germany
  • Jianglei Di, Guangdong University of Technology, China
  • Rafal Dunin-Borkowski, Forschungszentrum Jülich GmbH, Germany
  • Victor Dyomin, Tomsk State University, Russia
  • Pietro Ferraro, Institute of Intelligent Systems ISASI, Italy
  • Marc Georges, Univ de Liege Centre Spatial de Liege, Belgium
  • Yoshio Hayasaki, Utsunomiya University, Japan
  • Joby Joseph, Indian Institute of Technology Delhi, India
  • Björn Kemper, University of Muenster, Germany
  • Myung Kim, University of South Florida, United States
  • Jung-Ping Liu, Feng Chia University, Taiwan
  • Kyoji Matsushima, Kansai University, Japan
  • Pasquale Memmolo, Institute of Intelligent Systems ISASI, Italy
  • Fernando Mendoza Santoyo, Centro de Investigaciones en Optica AC, Mexico
  • Wolfgang Osten, Universität Stuttgart, Germany
  • Jae-Hyeung Park, Seoul National University, Republic Of Korea
  • Su Ping, Tsinghua University, China
  • Demetri Psaltis, École Polytechnique Fédérale de Lausanne, Switzerland
  • Bertrand Simon, Institut d'Optique Graduate School, France
  • Guohai Situ, Shanghai Inst. Opt. Fine Mech., China
  • Mikael Sjodahl, Lulea Tekniska Universitet, Sweden
  • Elena Stoykova, Bulgarian Academy of Sciences, Bulgaria
  • Nelson Tabiryan, Beam Engineering for Adv Measurements Co, United States
  • Enrique Tajahuerce, Universitat Jaume I, Spain
  • Laura Waller, University of California Berkeley, United States
  • Masahiro Yamaguchi, Institute of Science Tokyo, Japan
  • Haining Yang, Southeast University, China
  • Hiroshi Yoshikawa, Nihon University, Japan
  • Zeev Zalevsky, Bar-Ilan University, Israel
  • Yaping Zhang, Kunming Univ of Sci. and Tech., China
  • Wenjing Zhou, Shanghai University, China
  • Chao Zuo, Nanjing Univ of Science and Technology, China
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