Julie Adams
14 - 15 May 2025
Halle 02 / Alter Güterbahnhof
Heidelberg, Germany
Events
Julie Adams
IBM, Business Development Executive
About the Speaker
Julie Adams joined IBM in 2023 as a Business Development Executive for IBM's Semiconductor Research Group in Chiplets and Advanced Packaging. She holds a BSME from the University of Arizona and is an experienced advanced packaging development specialist with a successful track record of introducing new package technology to the market within the Semiconductor Industry. With over 25 years of experience in Global Business Development, Julie has served all market sectors while working for IDMs, OEMs, and OSATs. She has acquired expertise working for industry leaders such as Motorola (NXP), AMKOR, Flip Chip International, RVSI, and Royce Instruments. Additionally, Julie successfully managed a US-based representative company for a Hong Kong OSAT (UBOTIC) within the MEMS and Sensors Industry for over a decade. Julie plays a significant role in supporting the development and expansion of CPO technologies and capacity at IBM's OSAT facility in Bromont, Canada. Furthermore, she is closely collaborating with APC in their efforts towards CPO Standardization.
