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LAC Panels

Laser Applications Conference (LAC)

19 - 23 October 2025


Laser Applications Conference – Panels

Look for more information coming soon regarding panel descriptions and invited speakers within each session.

 

Brittle Materials Processing

Organizer: Stuart McLean, Coherent Corp., USA

Description will be available soon.

 

EUV, X-Ray Generation & Particle Acceleration

Organizer: Lahsen Assoufid, Argonne National Laboratory, USA

The rapid progress in extreme-power laser technology opened a path to the development of a new generation of small-scale EUV, X-ray and Gamma-ray light sources with unprecedented brightness and short pulses. These sources, which could fit on a tabletop or in a small-scale laboratory, will revolutionize many industrial, research, medical, defense and security applications. This session focuses on the latest developments, needs and challenges in high-power laser technologies tailored to methods for short (EUV, X- and Gamma-ray) wavelength generation and particle acceleration.

 

Fusion Energy

Organizer: Vincent Issier, MKS Insturments Inc., USA

Description will be available soon.

 

Global Security and Directed Energy

Organizer: Sandra Biedron, Element Aero and the Center for Bright Beams, USA

High-energy and high-lasers continue to mature and have myriad applications related to security and defense. This session will provide an overview of applications, such as directed energy, remote sensing,  securing the microelectronics supply chain, wavelength accessibility, and aspects  of unique user-accessible facilities for collaborative research and development. The session will also explore aspects of the workforce as well as supply chain for this unique sector of lasers and peripherals for global security.

 

Laser-Based Additive Manufacturing

Organizer: Houbertz Ruth, ThinkMade Engineering & Consulting, Germany

Description will be available soon.

 

Laser-Beam Delivery and Beam Manipulation of High-Power Laser Beams

Organizer: Bryan Germann, AEROTECH, USA

Description will be available soon.

 

Micro-Nano Machining

Organizer: Houbertz Ruth, ThinkMade Engineering & Consulting, Germany

Description will be available soon.

 

ML/AI for Laser Materials Processing

Organizer: Thomas Grünberger, Plasmo Industrietechnik GmbH, Austria

The session will provide an overview of the possibilities of AI and ML including examples in the field of laser material processing. Attention will be drawn on added value in the field of data analytics in all forms - descriptive, diagnostic, predictive and prescriptive analytics. Machine Learning/Artificial Intelligence are data driven approaches, so topics from data synthesis (acquisition), data preparation, model development and verification will be addressed.

 

Surface Modification & Micromachining

Organizer: Heather George, TRUMPF Inc., USA

 

THz Generation & Applications

Organizer: Kei Takeya, Institute for Molecular Science, Japan

Description will be available soon.

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